Canteliver Probe Card
MPI Cantilever Probe Card is broadly applied on gold bump and pad wafer tests for Exhibit driver, logic, and memory product. MPI’s cantilever probes tend to be the corresponding solution to your demands of fine pitch, smaller pad size, significant velocity, considerably less cleaning, multi-DUT, significant pin count, and ultra-minimal leakage requirements. With outstanding craftsmanship, modern architecture and proven methodologies according to mechanical and electrical simulation/measurement benefits, building MPI the highest cantilever service provider throughout the world.
FCB Probe Card
The FCB Probe Card is among the most mature technological know-how of buckling beam probe card. It is actually aimed to achieve the semiconductor ship manufacture time-to-marketplace (TTM) and price of take a look at (COT) desire. FCB is often a proven Alternative for a variety of semiconductor output checks from early engineering pilot-runs to large volume producing (HVM). FCB is ready for device necessitating large signal integrity probing (SI) and/or power integrity probing (PI). Purposes include things like cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB assures the globe’s greatest overall Value-of-possession (COO) for different DUT purposes.
EVS Probe Card
The EVS Probe Card is surely an improvement above the standard buckling beam probe card. Important capabilities are larger latest carrying capacity (C.C.C.) and reduce balanced Speak to drive (BCF), as well as Total MEMS-like characteristics. EVS can easily meet the prerequisite of advanced wafer probing. Precise alignment and fantastic planarity Handle tend to be the critical things contributing to secure Make contact with resistance. With its capability and functionality, EVS Probe Card is a super choice for Sophisticated probe cards.
Osprey probe card
The Osprey probe card is MPI’s solution to demand from customers for at any time finer pitch. It is actually suitable for scaled-down Al pad, and is also perfect for tiny pitch application with peripheral and whole array pattern. With specific alignment and superior planarity Command, Osprey can achieve greater productiveness by multi-DUT design. The forming wire (FW) style needle produced with MPI’s individual micro fabrication process not only delivers large-high-quality efficiency and also will allow easy needle alternative and shortens sustaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle and that is suitable for the demand of reduced pressure probing. It also comes with the chance to satisfy superior C.C.C. and higher pin counts application. The MEMS course of action makes sure hugely reliable needle characteristics, plus the Exclusive composition style enables specific alignment and planarity control.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations click here to come.
https://www.mpi-corporation.com/probecard/